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ISL59110
Data Sheet August 8, 2005 FN6104.1
8MHz Rail-to-Rail Composite Video Driver
The ISL59110 is a single rail-to-rail 3-pole output reconstruction filter with a -3dB roll-off frequency of 8MHz and a slew rate of 40V/s, with input signal DC restoration accomplished with an internal sync tip clamp. Operating from single supplies ranging from +2.5V to +3.6V and sinking an ultra-low 2mA quiescent current, the ISL59110 is ideally suited for low power, battery-operated applications. It also features inputs capable of reaching down to 0.15V below the negative rail. Additionally, an enable high pin shuts the part down in under 14ns. The ISL59110 is designed to meet the needs for micropower and bandwidth required in battery-operated communication, instrumentation, and modern industrial applications such as video on demand, cable set-top boxes, DVD players, and HDTV. The ISL59110 is offered in a space-saving SC-70 package guaranteed to a 1mm maximum height constraint and specified for operation from -40C to +85C temperature range.
Features
* 3rd order 8MHz reconstruction filter * 40V/s slew rate * Low supply current = 2mA * Power-down current less than 3A * Supplies from 2.5V to 3.6V * Rail-to-rail output * Input to 0.15V below VS* Input sync tip clamp * SAG correction reduces AC coupling capacitor size * Pb-free plus anneal available (RoHS compliant)
Applications
* Video amplifiers * Portable and handheld products * Communications devices
Ordering Information
PART NUMBER (See Note) ISL59110IEZ-T7 PACKAGE (Pb-Free) 6-Pin SC-70 TAPE & REEL 7" (3K pcs) PKG. DWG. # P6.049A
* Video on demand * Cable set-top boxes * Satellite set-top boxes * DVD players * HDTV * Personal video recorders
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pinout
ISL59110 (6-PIN SC-70)* TOP VIEW
IN+ 1 GND 2 SAG 3 LPF + 6 VS+ 5 EN 4 OUT
*1mm MAXIMUM HEIGHT GUARANTEED
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.
ISL59110
Absolute Maximum Ratings (TA = 25C)
Supply Voltage from VS+ to GND . . . . . . . . . . . . . . . . . . . . . . . 3.6V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND -0.3V Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 40mA Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65C to +125C Ambient Operating Temperature . . . . . . . . . . . . . . . .-40C to +85C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
DESCRIPTION INPUT CHARACTERISTICS VCC IDD-ON IDD-OFF VOLS VCLAMP ICLAMP_CHG ICLAMP_DCHG RIN AV ASAG PSRR VOH ISC
VS+ = 3.3V, TA = 25C, RL = 150 to GND, CL = 0.1F, unless otherwise specified. CONDITIONS MIN TYP MAX UNIT
PARAMETER
Supply Voltage Range Quiescent Supply Current Shutdown Supply Current Output Level Shift Voltage Input Voltage Clamp Clamp Charge Current Clamp Discharge Current Input Resistance Voltage Gain SAG Correction DC Gain to VOUT DC Power Supply Rejection Output Voltage High Swing Output Short-Circuit Current VIN = 500mV, EN = VDD, no load EN = 0V VIN = 0V, no load IIN = -1mA VIN = VCLAMP - 100mV VIN = 500mV 0.5V < VIN < 1.0V RL = 150 SAG open VDD = 2.7V to 3.3V VIN = 2V, RL = 150 to GND VIN = 2V, to GND through 10 VIN = 100mV, out short to VDD through 10
2.5 2
3.6 2.75 3
V mA A mV mV mA A M
60 -40
130 -15 -6
200 +10 -3 7.5
2.5 0.5 1.95
5 3 2.0 2.25
2.04
V/V V/V dB V
43 2.85
63 3.2 -94 -65
mA mA
65 -3
115 0 +3 0.8
IENABLE VIL VIH ROUT
Enable Current Disable Threshold Enable Threshold Shutdown Output Impedance
3.3V, enable pin = 0V VDD = 2.7V to 3.3V VDD = 2.7V to 3.3V EN = 0V DC EN = 0V, f = 4.5MHz
A V V
1.6 3.6 4.5 3.4 5.9
k k
AC PERFORMANCE BW BW 0.1dB Bandwidth -3dB Bandwidth Normalized Stopband Gain dG Differential Gain RL = 150, CL = 5pF RL = 150, CL = 5pF f = 27MHz NTSC & PAL DC coupled NTSC & PAL AC coupled dP Differential Phase NTSC & PAL DC coupled NTSC & PAL AC coupled D/DT SNR TON Group Delay Variation Signal To Noise Ratio Enable Time f = 100kHz, 5MHz 100% white signal VIN = 500mV, VOUT to 1% 4 8 -24.2 0.10 0.84 0.05 0.62 5.4 65 200 MHz MHz dB % % ns dB ns
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FN6104.1 August 8, 2005
ISL59110
Electrical Specifications
DESCRIPTION TOFF +SR -SR tF tR Disable Time Positive Slew Rate Negative Slew Rate Fall Time Rise Time VS+ = 3.3V, TA = 25C, RL = 150 to GND, CL = 0.1F, unless otherwise specified. (Continued) CONDITIONS VIN = 500mV, VOUT to 1% 10% to 90%, VIN = 1V step 90% to 10%, VIN = 1V step 2.5VSTEP, 80% - 20% 2.5VSTEP, 20% - 80% 20 -20 MIN TYP 14 41 -30 25 22 70 -70 MAX UNIT ns V/s V/s ns ns
PARAMETER
Typical Performance Curves
0.5 VDD=+3.3V RL=150 0.3 CL=5pF -0.1dB BW @ 4MHz
NORMALIZED GAIN (dB)
0.1
-0.1
-0.3
-0.5 100K
1M FREQUENCY (Hz)
10M
FIGURE 1. GAIN vs FREQUENCY -0.1dB
FIGURE 2. GAIN vs FREQUENCY -3dB POINT
FIGURE 3. GAIN vs FREQUENCY -3dB
FIGURE 4. GAIN vs FREQUENCY FOR VARIOUS RLOAD
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FN6104.1 August 8, 2005
ISL59110 Typical Performance Curves
FIGURE 5. GAIN vs FREQUENCY FOR VARIOUS CLOAD
FIGURE 6. MAXIMUM OUTPUT MAGNITUDE vs INPUT MAGNITUDE
FIGURE 7. PHASE vs FREQUENCY
100 OUTPUT IMPEDANCE ()
FIGURE 8. PSRR vs FREQUENCY
VDD=+3.3V
10
1
0.1
0.01 10K
100K
1M FREQUENCY (Hz)
10M
100M
FIGURE 9. OUTPUT IMPEDANCE vs FREQUENCY
FIGURE 10. ISOLATION vs FREQUENCY
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FN6104.1 August 8, 2005
ISL59110 Typical Performance Curves
FIGURE 11. MAXIMUM OUTPUT vs LOAD RESISTANCE
FIGURE 12. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 13. LARGE SIGNAL STEP RESPONSE
FIGURE 14. SMALL SIGNAL STEP RESPONSE
FIGURE 15. ENABLE TIME
FIGURE 16. DISABLE TIME
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FN6104.1 August 8, 2005
ISL59110 Typical Performance Curves
FIGURE 17. HARMONIC DISTORTION vs FREQUENCY
FIGURE 18. HARMONIC DISTORTION vs OUTPUT VOLTAGE
FIGURE 19. GROUP DELAY VERSUS FREQUENCY
FIGURE 20. -3dB BANDWIDTH VERSUS INPUT RESISTANCE
FIGURE 21. SLEW RATE vs SUPPLY VOLTAGE
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FN6104.1 August 8, 2005
ISL59110 Typical Performance Curves
JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 450mW
JA
0.5 0.45 POWER DISSIPATION (W) 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0
0.55 0.5 POWER DISSIPATION (W) 0.45 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 500mW
-6 W 70 C/ SC 00 =2 J
SC =2 7 0 20 6 C /W
A
0
25
50
75 85 100
125
150
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (C)
AMBIENT TEMPERATURE (C)
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
SYNC CLAMP VDD VDD SALLEN KEY LOW PASS FILTER + CIN IN RIN 100nF C1 C3 IN R1 R2 C2 SAG NETWORK + OUT R6 R7 SAG R5 EN EN=GND: SHUTDOWN IDD~0 EN=VDD: ACTIVE IDD~1.5mA R4 AC COUPLING CAPACITOR C5 47uF C4 22uF ROUT 75 RL 75
VDD
R3
VDC + -
GND
FIGURE 24. BLOCK DIAGRAM
Application Information
The ISL59110 is a single supply rail-to-rail output amplifier achieving a -3dB bandwidth of around 8MHz and slew rate of about 40V/s while demanding only 2mA of supply current. This part is ideally suited for applications with specific micropower consumption and high bandwidth demands. As the performance characteristics above and the features described below, the ISL59110 is designed to be very attractive for portable composite video applications.
The ISL59110 features a sync clamp, low pass function, and SAG network at the output facilitating reduction of typically large AC coupling capacitors. See Figure 24.
Internal Sync Clamp
The typical embedded video DAC operates from a ground referenced single supply. This becomes an issue because the lower level of the sync pulse output may be at a 0V reference level to some positive level. The problem is presenting a 0V input to most single supply driven amplifiers will saturate the output stage of the amplifier resulting in a
FN6104.1 August 8, 2005
7
ISL59110
clipped sync tip and degrading the video image. A larger positive reference may offset the input above its positive range. The ISL59110 features an internal sync clamp and offset function to level shift the entire video signal to the best level before it reaches the input of the amplifier stage. These features are also helpful to avoid saturation of the output stage of the amplifier by setting the signal closer to the best voltage range. The simplified block diagram of the ISL59110 in Figure 24 is divided into four sections. The first, Section A is the Sync Clamp. The AC coupled video sync signal is pulled negative by a current source at the input of the comparator amplifier. When the sync tip goes below the comparator threshold the output comparator is driven negative, The PMOS device turns on clamping sync tip to near ground level. The network triggers on the sync tip of video signal. Typically this is accomplished with 220F coupling capacitor, a large and somewhat costly solution providing a low frequency pole around 5Hz. If the size of this capacitor is even slightly reduced we have found that the accompanying phase shift in the 50Hz to 100Hz frequency range results in field tilt resulting in a degraded video image. The internal SAG network of the ISL59110 replaces the 220F AC coupling capacitor with a network of two smaller capacitors as shown in Figure 25. Additionally, the network is designed to place a zero in the ~30Hz range, providing a small amount of peaking to compensate the phase response associated with field tilt.
DC Output Coupling
The ISL59110 internal sync clamp makes it possible to DC couple the output to a video load, eliminating the need for any AC coupling capacitors, saving board space and additional expense for capacitors making the ISL59110 is designed to be extremely attractive for portable video applications Additionally, this solution completely eliminates the issue of field tilt in the lower frequency. The trade off is greater demand of supply current. Typical load current for AC coupled is around 3mA compared to typical 6mA used when DC coupling.
+ ENABLE ROUT
The Sallen Key Low Pass Filter
The Sallen Key in a classic low pass configuration illustrated in Figure 24. This provides a very stable low pass function, and in the case of the ISL59110, a three-pole roll-off at around 8MHz. The three-pole function is accomplished with an RC low pass network placed in series with and before the Sallen Key. One pole provided by the RC network and poles two and three provided by the Sallen Key for a nice threepole roll-off at around 8MHz. If more aggressive, multiplepole roll-offs are needed, multiple ISL59110 can be placed in series. There will, of course, be a loss of bandwidth as additional devices are added.
TELEVISION OR VCR
AC Output Coupling and the SAG Network
Composite video signals carry viable information at frequencies as low as 30Hz up to 5MHz. When a video system output is AC coupled it is critical that the filter represented by the output coupling capacitor and the surrounding resistance network provide a band pass function with a low pass band low enough to exclude very low frequencies down to DC, and with a high pass band pass sufficiently high to include frequencies at the higher end of the video spectrum.
SAG NETWORK AC COUPLING CAPACITOR C5 R6 ROUT RL
FIGURE 26. DC COUPLE
R7
C4
R5 R4
FIGURE 25. SAG NETWORK AND AC COUPLING CAPACITORS
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FN6104.1 August 8, 2005
ISL59110
Output Drive Capability
The ISL59110 does not have internal short circuit protection circuitry. If the output is shorted indefinitely, the power dissipation could easily overheat the die or the current could eventually compromise metal integrity. Maximum reliability is maintained if the output current never exceeds 40mA. This limit is set by the design of the internal metal interconnect. Note that in transient applications, the part is robust. Short circuit protection can be provided externally with a back match resistor in series with the output placed close as possible to the output pin. In video applications this would be a 75 resistor and will provide adequate short circuit protection to the device. Care should still be taken not to stress the device with a short at the output. Where: VS = Supply voltage ISMAX = Maximum quiescent supply current VOUT = Maximum output voltage of the application RLOAD = Load resistance tied to ground ILOAD = Load current By setting the two PDMAX equations equal to each other, we can solve the output current and RLOAD to avoid the device overheat.
Power Supply Bypassing Printed Circuit Board Layout
As with any modern operational amplifier, a good printed circuit board layout is necessary for optimum performance. Lead lengths should be as short as possible. The power supply pin must be well bypassed to reduce the risk of oscillation. For normal single supply operation, a single 4.7F tantalum capacitor in parallel with a 0.1F ceramic capacitor from VS+ to GND will suffice.
Power Dissipation
With the high output drive capability of the ISL59110, it is possible to exceed the 125C absolute maximum junction temperature under certain load current conditions. Therefore, it is important to calculate the maximum junction temperature for an application to determine if load conditions or package types need to be modified to assure operation of the amplifier in a safe operating area. The maximum power dissipation allowed in a package is determined according to:
T JMAX - T AMAX PD MAX = ------------------------------------------- JA
Printed Circuit Board Layout
For good AC performance, parasitic capacitance should be kept to minimum. Use of wire wound resistors should be avoided because of their additional series inductance. Use of sockets should also be avoided if possible. Sockets add parasitic inductance and capacitance that can result in compromised performance.
Where: TJMAX = Maximum junction temperature TAMAX = Maximum ambient temperature JA = Thermal resistance of the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the load, or: for sourcing:
V OUT PD MAX = V S x I SMAX + ( V S - V OUT ) x --------------R
L
for sinking:
PD MAX = V S x I SMAX + ( V OUT - V S ) x I LOAD
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FN6104.1 August 8, 2005
ISL59110 Small Outline Transistor Plastic Packages (SC70-6)
0.20 (0.008) M C L b e C VIEW C
P6.049A
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES SYMBOL A MIN 0.031 0.001 0.034 0.006 0.006 0.004 0.004 0.073 MAX 0.039 0.004 0.036 0.012 0.010 0.008 0.006 0.085 MILLIMETERS MIN 0.80 0.025 0.85 0.15 0.15 0.10 0.10 1.85 MAX 1.00 0.10 0.90 0.30 0.25 0.20 0.15 2.15 NOTES 6 6 3 3 4 5 8 Rev. 0 7/05 NOTES: 1. Dimensioning and tolerance per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC70 and JEDEC MO203AB. 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
6 C L 1
5
4 C L E E1
A1 A2 b b1 c
2
3
e1 C D C L
c1 D E E1
0.084 BSC 0.045 0.053
2.1 BSC 1.15 1.35
A
A2
A1
SEATING PLANE -C-
e e1 L L1
0.0256 Ref 0.0512 Ref 0.010 0.018
0.65 Ref 1.30 Ref 0.26 0.46
0.016 Ref. 0.006 BSC 6 0.004 0 8
0.400 Ref. 0.15 BSC 6 0.10 0
0.10 (0.004) C
L2 N R
WITH PLATING c
b b1 c1
BASE METAL
4X 1 R1 R GAUGE PLANE SEATING PLANE C L1 4X 1 VIEW C L
4. Footlength L measured at reference to gauge plane. 5. "N" is the number of terminal positions. 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
L2
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 10
FN6104.1 August 8, 2005

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